MIL-PRF-38534K Compliance Testing

MIL-PRF-38534K Group C 

Test Method Conditions (PI)
External Visual 2009  
PIND 2020  
Temperature Cycling 1010 C, 20 Cycles
Temperature Cycling 1010 C, 10 Cycles
Mechanical Shock 2002 B, Y1 Direction or 3000 g's, Y1 Direction
Seal (Fine and Gross) 1014  
Visual Examination 1010  
Endpoint Electrical *  
Steady state life 1005 1000 hours at 125°C or equivalent (1005)
Endpoint Electrical *  
Internal Water Vapor 1018  
Internal Visual and Mechanical 2014  
Wire bond strength 2011  
Element Shear 2019  
ESD 3015  
* in accordance with the applicable device specification
 

MIL-PRF-38534K Group D

Description Method Condition (PI)
Thermal Shock 1011 C
Stabilization Bake 1008 150°C, 1 Hour
Lead Integrity 2004 B2
Seal (Fine and Gross) 1014 A, D
Salt Atmosphere 1009 A, D
Metal Package Isolation 1003 600 V DC , 100 nA Max.
 

MIL-PRF-38534K Group K

Test Method Conditions (PI)
Preseal Burn-in 1030  
Non-Destructive Bond Pull 2023  
Internal Visual 2017  
Temperature Cycling 1010 C, 10 Cycles
Mechanical Shock or Constant Acceleration 2002/2001 B, (Y1 Direction) 3000 g's, Y1 Direction only
PIND 2020 Condition A shall be used for Class K,
unless otherwise specified.
Pre Burn-in Electrical *  
Burn-in 1015  
Final Electrical Test *  
Seal (Fine and Gross) 1014  
Radiographic** 2012  
External Visual 2009  
 * in accordance with the applicable device specification
** Will be designed to meet requirements, but Radiographic Test Results not included.