RF+ System-in-Package

The capabilities of an integrated microwave assembly (IMA) in a 30 mm² surface mount package.

New RF+™ SiP platform delivers wideband signal conditioning in a high-volume package for affordable mass in next-generation defense systems

The New RF Solution for Next-Gen Defense

Highly integrated RF signal conditioning, digitally enabled. 

Use this SiP as a co-processor to a Direct RF FPGA or any mixed signal device. You can also use this product in any RF application where size, weight, power consumption and cost are a factor such as smart antennas.

Revolutionary Miniaturization. Incorporates Spectrum Control’s industry-leading technology for high performance, wideband signal conditioning with full isolation, filtering, digital control, and power supply.

Dramatic Cost Reduction. Surface-mount design and integrated digital control offers up to 86% reduction in lifecycle costs, 3x the design velocity, and significant reduction in design and integration NRE.

Customizable. Talk with us about your customization needs including frequency band of interest, frequency conversion and power amplification. Examples: x-Band Tx/Rx, EW front end, mmWave block converter, clock generation circuitry.

Technical Overview

• Designed for high volume production and optimized to minimize supply chain risk
   
• Wide frequency coverage through 40 GHz
   
• Integrated digital gateway for command/control with health/temperature monitoring
   
• Calibration for optimum spectral performance
   
• Multi-channel platform capable
   
• US-manufactured and sourced
   
• Launch offering: RX Front End 6-18 GHz, filtered and 2-20 GHz unfiltered with 2 GHz IBW

Download product brief

Due to the nature of this technology, we are limiting the release of specifics at this time. If you’d like more information about product availability and customization needs, please contract the Spectrum Control team directly or use this secure form to be introduced to the team.