IMA Technology
Successful IMA development requires multi-disciplinary engineering with the ability to apply the right combination of design, manufacturing and testing technology to meet the specification. Spectrum Control has been designing and building custom IMAs for mission-critical applications for more than 40 years.
Design Technology
Successful IMA design involves a combination of design capabilities including RF, digital, and packaging
We employ a range of design tools including traditional circuit layout technology and the latest modeling and simulation tools. This allows us to products that meet our customers' cost, performance and footprint requirements.
Manufacturing Technology
Spectrum Control's multiple manufacturing locations in the US and UK allow us to deploy the best combination of manufacturing processes to meet you design requirements. These include
- High density PCB
- System in Package (SiP)
- Multi-chip Modules (MCM)
- Chip and Wire
- Hybrid
Processes
- Gallium Nitride (GaN)
- Silicon LDMOS
- Silicon MOSFET
- Gallium Arsenide (GaAs)
- GaAs MMIC
- GaAs MESPHET
- GaAs pHEMT
- Glass
- Thick film interconnect
- Thin film interconnects