Class B MIL-PRF-28861 Test Sequence Summary

Class B Reliability Levels are outlined in MIL-PRF-28861 and is prescribed for most military/aerospace requirements. It is more stringent than MIL-PRF-15733, requiring 100% screening that includes thermal shock, voltage conditioning, and x-ray.

Periodic Group B testing is performed on units selected at random from production lots.

Inspection

Class B

“R” level testing

Group I
“R” level screening is performed by Spectrum Control's Hi-Rel Laboratory as detailed below. Customers requiring special tests may order to their own specifications or simply order to level R and then note additions or deviations.
 
“R” level test sequence
 
(100% testing unless otherwise specified)
 
Thermal Shock: 5 cycles from -55°C to +125°C in accordance with MIL-STD-202, Method 107D, Condition A.
 
Burn-in: 100 hours at 1.4x rated DC voltage, 125°C.
 
Seal Test: MIL-STD-202, Method 112, Test Condition A. Hermetic sealed parts only.
 
Capacitance and Dissipation Factor: MIL-STD-202, Method 305, frequency 1kHz.
 
Dielectric Withstanding Voltage: 2.5 times the rated DC voltage for 5 ±1 second at 25°C, with 50 mA maximum charging current.
 
Insulation Resistance: MIL-STD-202, Method 302, 125°C at rated DC voltage and room temperature (25°C). The 125°C requirement shall be 10% of the specified catalog IR at 25°C.
 
DC Resistance: MIL-STD-202, Method 303.
 
Insertion Loss Test: Sample per MIL-PRF-15733. At full rated load in accordance with MIL-STD-220. The minimum insertion loss shall be defined in the filter catalog.
 
Visual and Mechanical: In accordance with MIL-PRF-15733.
 
Marking: All filters which have successfully completed the test sequence shall be marked with an “R” in the second part of the number. For example, a standard SCI-2130-004 becomes SCI-R2130-004 and 9051-100-0000 becomes 9051-R100-0000, and 51-719-011 becomes 51-R719-011 after completion of the Hi-Rel Level “R” Test Sequence.
AC voltage drop (when applicable) X
Voltage and temperature limits of capacitance X
Insertion loss (at temperature) X
Barometric pressure (reduced) X
Temperature rise X
Current overload X
Terminal strength X
Thermal shock and immersion X

Group II
Subgroup 1
Life X
Subgroup 2
Resistance to soldering heat X
Salt spray (corrosion) X
Radiographic inspection X
Subgroup 3
Resistance to solvents X
 
Shock (specified pulse) X
Vibration (high frequency) X
Moisture resistance X
Seal (when applicable) X
Radiographic inspection X